Objective 1: Develop 50 Gb/s energy efficient photonics and electronics transceiver components

STREAMS aims at the mid-board interconnection line-rates of 50 Gb/s as a way to further enhance bandwidth density and link energy efficiency while lowering package pin-count requirements. To achieve that, STREAMS will develop all the necessary 50Gb/s component toolkit spanning along the entire range of silicon photonic actives and their driving electronics, in order to exploit them as the building blocks in its 1.6 Tb/s WDM optical engine.ob 1

STREAMS will exploit the maturity of Silicon Photonics (SiPho) technology towards scaling its integration density beyond current boundaries and implementing 32-element Si-Pho arrays at a competitive chip-size/channel density ratio.


Objective 2: Develop III-V on Si lasers and nano-amplifiers that enable DWDM optical interconnects
ICT-STREAMS approach has some decisive differences to state-of-the art concepts pursued by others in the field of InP on Si, enabling complete embedding of the gain structure in the back-end of the line  

ob 2(BEOL) process steps and making this laser fabrication method fully CMOS compatible, while the integrated in-plane lasers will require no mechanical beam alignment to the Silicon chip.


Objective 3: Thermal drift compensation subsystem (TDCS) employing non-invasive integrated monitors
High density integrated active optical components may trigger severe thermal crosstalk phenomena affecting overall WDM wavelength tenability. ICT-STREAMS will address this ever-lasting challenge of  

thermalDrift

active photonic devices with an innovative Thermal Drift Compensation system employing non-invasive, wavelength monitoring and control technology for WDM Silicon Photonics components that will bring significant impact on the real-life applicability of Si-Pho technology.


Objective 4: Develop a low-loss, low cost single-mode polymer PCB host platform and establish a cost-efficient electro-optic integration process
Photonic technology industrialization requires a practical, compact, reliable and cost-effective solution for embedding optical devices.ob 4

ICT-STREAMS single mode polymer Electro-Optical PCB employing adiabatic optical coupling concept with high-density, high-frequency RF and optical I/O interfaces aims to drive things further enabling single step chip-to-board assembly, relaxing manufacturing time and cost requirements.


Objective 5: Develop software controlled, energy efficient WDM Embedded Optic Modules (EOM) with 1.6Tb/s throughput
ICT-STREAMS optical engine will push the performance envelope of transceivers technology by means of number of WDM channels (32x) and channel data rate (50Gb/s) towards a 1.6Tb/s throughput optical engine with 3.75pJ/bit target power efficiency


Objective 6: Develop a 25Tb/s throughput EOPCB-mounted, loss-less 16x16 WDM routing platform
ICT-STREAMS leverages WDM parallel transmission to a powerful routing technology that resolves current bandwidth and switch-latency barriers, allowing for 25Tb/s aggregate throughput, contention-free, on-the-fly massive data movements for multi-socket any-to-any interconnection.  Such a 16-socket server blade configuration would enable Exascale computing in a quarter of the physical size required with today’s standards. ICT-STREAMS interconnection system also strongly supports novel Rack Scale Architectures for compute, memory, and storage resources disaggregation concepts. 


Objective 7: Optical Path Interconnect (OPI) prototype: STREAMS on-board optical chip-to-chip interconnection system for multi-socket server boards with 25.6 Tb/s aggregate bidirectional throughput
ICT-STREAMS leverages WDM parallel transmission to a powerful routing technology that resolves current bandwidth and switch-latency barriers, allowing for 25Tb/s aggregate throughput, contention-free, on-the-fly massive data movements for multi-socket any-to-any interconnection.  Such a 16-socket server blade configuration would enable Exascale computing in a quarter of the physical size required with today’s standards. ICT-STREAMS interconnection system also strongly supports novel Rack Scale Architectures for compute, memory, and storage resources disaggregation concepts.